ETCHING METHOD

PROBLEM TO BE SOLVED: To provide an etching method by which variations in the amount of etching is suppressed.SOLUTION: An etching method includes: an accommodating step of immersing an object 1 having a flat etched surface 1a into an etchant 3 held in a container 2 having a flat bottom surface 2a,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KAWAGUCHI YOSHIYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an etching method by which variations in the amount of etching is suppressed.SOLUTION: An etching method includes: an accommodating step of immersing an object 1 having a flat etched surface 1a into an etchant 3 held in a container 2 having a flat bottom surface 2a, and accommodating the object 1 in the container 2 so that the etched surface 1a is parallel to the bottom surface 2a; and an agitating step of agitating the etchant 3 by repeatedly inclining the bottom surface 2a of the container 2 toward one side x1 and the other side x2 interposing a fulcrum 2b therebetween to such an extent that the object 1 is not exposed from the etchant 3, the fulcrum 2b being one point of the bottom surface 2a of the container 2.