METHOD FOR MANUFACTURING WIRING BOARD AND COMPOSITION FOR SEED LAYER FORMATION

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board which can obtain high productivity and a finer wiring pattern.SOLUTION: A method for manufacturing a wiring board 1000 comprises steps of: printing or applying a composition for seed layer formation including a metal salt and a reducing agent, on a substrate 100 which has an insulator layer 3 provided with a bottom layer wiring pattern 2 and an opening 4, and heating the composition for seed layer formation printed or applied on the substrate 100 to form a seed layer 5; forming a wiring layer 7 on a predetermined region on the seed layer 5, which is a region smaller than a region where the seed layer 5 is arranged; and removing the seed layer 5 exposed not being covered by the wiring layer 7. In the step of forming the wiring layer 7, a resist pattern 6 is formed in a region on the seed layer 5 excluding the predetermined region, the wiring layer 7 is formed on the seed layer 5 which is exposed not being covered by the resist pattern 6, and then the resist pattern 6 is removed, to form the patterned wiring layer 7 on the seed layer 5.