HEATER FOR BONDING APPARATUS AND METHOD FOR COOLING THE SAME

PROBLEM TO BE SOLVED: To cool a heater for a bonding apparatus more effectively.SOLUTION: There is provided a plate-like heater 30 for a bonding apparatus having a lower surface 31b on which a bonding tool 40 is mounted, and an upper surface 31a to which a heat insulating material 20 attached. A num...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SEYAMA KOHEI, CHIDA YASUHIRO, SUMIYA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To cool a heater for a bonding apparatus more effectively.SOLUTION: There is provided a plate-like heater 30 for a bonding apparatus having a lower surface 31b on which a bonding tool 40 is mounted, and an upper surface 31a to which a heat insulating material 20 attached. A number of capillary slits 35 are provided on the upper surface 31a. The number of capillary slits 35 and the mating surface 21 of a heat insulating material 20 to be attached to the upper surface 31a form a number of capillary cooling flow paths 37 extending from a cavity 36 to a side surface 33.