NON-AQUEOUS CLEANSER AND ETCHING METHOD OF SILICON SUBSTRATE

NON-AQUEOUS CLEANSER AND ETCHING METHOD OF SILICON SUBSTRATE

PROBLEM TO BE SOLVED: To provide a non-aqueous cleansing liquid in which both a fluorocarbon layer and a resist material can be removed and a vaporization loss of cleansing liquid components in use for a cleaning process is suppressed, and to provide an etching method of a silicon substrate accordin...

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Bibliographische Detailangaben
Hauptverfasser: MORI DAIJIRO, HARAGUCHI TAKAYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a non-aqueous cleansing liquid in which both a fluorocarbon layer and a resist material can be removed and a vaporization loss of cleansing liquid components in use for a cleaning process is suppressed, and to provide an etching method of a silicon substrate according to the BOSCH method using the non-aqueous cleansing liquid.SOLUTION: A fluoroalkanol and a quaternary ammonium hydroxide, as needed, are blended in the non-aqueous cleansing liquid. As the fluoroalkanol, a compound represented by formulas (1) H(CF)CH-OH and (2) F(CF)(CH)-OH is preferable (in the formulas (1) and (2), a and b are each integers from 2 to 6 and c is an integer from 1 to 2).