SUBSTRATE MOUNTING STRUCTURE OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate mounting structure improved to facilitate mounting and demounting of an option substrate, being mounted detachably on the case of an electronic apparatus, while eliminating application of unnecessary stress to a substrate or mounting components incident t...

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Bibliographische Detailangaben
1. Verfasser:	NAKAI MASARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate mounting structure improved to facilitate mounting and demounting of an option substrate, being mounted detachably on the case of an electronic apparatus, while eliminating application of unnecessary stress to a substrate or mounting components incident to the mounting/demounting operation.SOLUTION: An option substrate 7 is mounted detachably in a case 1 via a connector 7a, and an upper cover 4 made of mold resin is attached to the opening of the case 1 covering the substrate 7. In such an electronic apparatus, a retainer spring member 4a is molded integrally on the inner surface side of the upper cover 4, and the option substrate 7 mounted on the case 1 via the retainer spring member 4a is held at a predetermined position while being retained.