ADHESIVE COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD WITH REINFORCEMENT PLATE USING THE SAME

PROBLEM TO BE SOLVED: To provide an adhesive composition and a film shape adhesive agent that can combine adhesiveness, and an indispensable property for an adhesive agent for a flexible printed wiring board of flow and heat resistance, adhesive force or the like; and a flexible printed wiring board...

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Bibliographische Detailangaben
Hauptverfasser:	UCHIDA YOSHIFUMI, SUGAWARA JUN, KIMURA ATSUSHI, KAIMORI SHINGO, ASAI SHOGO, YONEZAWA TAKAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive composition and a film shape adhesive agent that can combine adhesiveness, and an indispensable property for an adhesive agent for a flexible printed wiring board of flow and heat resistance, adhesive force or the like; and a flexible printed wiring board with a reinforcement plate using the same.SOLUTION: An adhesive composition includes: a polyamide resin (A); a novolak epoxy resin (B); and a resin (C) that is liquid at 25°C. The polyamide resin (A) has a functional group that can react with an epoxy group. The novolak epoxy resin (B) has compatibility with the polyamide resin (A). The resin (C) has compatibility with the polyamide resin (A) and the novolak epoxy resin (B), and has a functional group that can react with one or both of the polyamide resin (A) and the novolak epoxy resin (B).