MOLDED SOLDER WITH METAL WIRE, AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide: a molded solder with a metal wire that improves adhesion between a wire material and a taped-shaped solder; and a method for producing the same.SOLUTION: A molded solder 10 with a metal wire is produced by press-inserting at lest two wire materials 2 having a higher...

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Bibliographische Detailangaben
Hauptverfasser:	ASAGI TAKESHI, HIRAI MASATOSHI, MITANI SUSUMU, TAKANO MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: a molded solder with a metal wire that improves adhesion between a wire material and a taped-shaped solder; and a method for producing the same.SOLUTION: A molded solder 10 with a metal wire is produced by press-inserting at lest two wire materials 2 having a higher melting point than solder into a tape-shaped solder 1 along both side end portions of the tape-shaped solder 1 at a predetermined distance from side ends thereof so as to expose a part of the surface of the wire materials 2. The wire materials 2 are metal wires previously coated with solder.