SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To bond a semiconductor device having bump electrodes and an opposing substrate without the occurrence of poor bonding.SOLUTION: A semiconductor device 10 includes a semiconductor element 20 having an electrode part 21aa and a bump electrode 30 arranged on the electrode part 21aa. The bump electrode 30 includes a column 31 provided on the electrode part 21aa, a projection 32 which is provided on the column 31 and extends across from one side edge to an opposite side edge of the column 31, and a solder 33 for covering the projection 32. By providing such projection 32 in the bump electrode 30, the semiconductor device 10 and an opposing substrate can be bonded without the occurrence of failure such as a short circuit and an opening.