RELEASE FILM

PROBLEM TO BE SOLVED: To provide a release film in which flatness is not impaired by surface roughness and surface projection of a release layer formation surface, further surface roughness and surface projection generated in time passing or when being performed by heat treatment, and further foreig...

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Bibliographische Detailangaben
Hauptverfasser:	DOMITSU MITSUO, NOGAMI YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a release film in which flatness is not impaired by surface roughness and surface projection of a release layer formation surface, further surface roughness and surface projection generated in time passing or when being performed by heat treatment, and further foreign matter adhesion by electrification, or falling and chipping of the release layer, and a fault of breaking of a molding film and cissing or the like of a pinhole shape is not generated in a next process, in especially the release film that is used for sheet molding (or adhesive layer molding) of green sheet formation or the like for a ceramic capacitor in which flatness is required.SOLUTION: A release film has high flatness in heating and time passing by that a film having high flatness is made a substrate, and a silicon oxide coating having a thickness of 40-160 nm is formed as a middle layer, and has antistatic properties and high adhesion.