MICROSTRUCTURE TRANSCRIPTION DEVICE, MICROSTRUCTURE TRANSCRIPTION STAMPER, AND MICROSTRUCTURE TRANSCRIPTION METHOD

PROBLEM TO BE SOLVED: To provide a microstructure transcription stamper capable of forming a thin, even resin remaining film on a substrate by collective transcription by the stamper, even if the stamper has a large-density and large-area pattern.SOLUTION: In a microstructure transcription stamper 1...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WASHITANI RYUTA, OGINO MASAHIKO, MIYAUCHI AKIHIRO, MORI KYOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a microstructure transcription stamper capable of forming a thin, even resin remaining film on a substrate by collective transcription by the stamper, even if the stamper has a large-density and large-area pattern.SOLUTION: In a microstructure transcription stamper 1 of the present invention, a pattern of the microstructure transcription stamper 1 includes a plurality of chip regions 6, and a resin supply pattern 9, which supplies a resin of a predetermined volume forming a resin film on a substrate by letting the resin flow toward a chip pattern formed in each of the chip regions 6 when the microstructure transcription stamper 1 is pressed against the resin film, is included in an outer peripheral part of each of the chip regions 6.