VAPOR DEPOSITION METHOD AND DEVICE

PROBLEM TO BE SOLVED: To provide an evaporation and sublimation method for a vapor deposition material of a vacuum vapor deposition device capable of operating continuously for a long period while preventing deterioration of the vapor deposition material and adhesion of fine particles, and to provid...

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Bibliographische Detailangaben
Hauptverfasser: EBATA TAKASHI, IZEKI SEIJI, KITANO TOMOHIKO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an evaporation and sublimation method for a vapor deposition material of a vacuum vapor deposition device capable of operating continuously for a long period while preventing deterioration of the vapor deposition material and adhesion of fine particles, and to provide a device for vacuum vapor deposition.SOLUTION: There is provided an evaporation and sublimation method of depositing a thin film on a surface of a vapor-deposited material in a vacuum device. The evaporation and sublimation method is characterized in that a device comprises a heating wave source and a container containing the vapor deposition material, the material contained in the container is gasified by being heated directly from a surface of the vapor deposition material from the outside of the container through a window made of a material capable of transmitting a heating wave from the heating wave source, which has a wavelength mainly based upon infrared light, and a mechanism is included which prevents the material from being solidified on a wall surface by heating the inner surface of the container to a sublimation temperature or higher.