TARGET JOINED BODY

PROBLEM TO BE SOLVED: To provide a target joined body that can have a thin film formed with a uniform thickness by preventing irregularity in formed film thickness in a plane when performing film deposition through sputtering using a Cu-Mn alloy sputtering target.SOLUTION: A target joined body inclu...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMURA HITOMI, NAKANE YASUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a target joined body that can have a thin film formed with a uniform thickness by preventing irregularity in formed film thickness in a plane when performing film deposition through sputtering using a Cu-Mn alloy sputtering target.SOLUTION: A target joined body includes a sputtering target, a backing plate, and a brazing filler metal, and a reverse surface of the sputtering target is joined with the backing plate with the brazing filler metal. The sputtering target is a Cu-Mn alloy containing Mn by 2-30 atom%, and the total of area of projection of porosity present in the brazing filler metal on the reverse surface of the sputtering target is 16% or less of the area of the whole joining region on the reverse surface of the sputtering target.