DEVICE AND METHOD FOR ETCHING

PROBLEM TO BE SOLVED: To solve such a problem that, when a fine circuit pattern is formed during a circuit forming process of a copper-clad substrate, a line width of a circuit pattern is likely to vary depending on the level of skill of operators in the conventional control methods where processing...

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Bibliographische Detailangaben
Hauptverfasser:	YONETAKE SATORU, NISHIMURA NAOKI, SATO SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve such a problem that, when a fine circuit pattern is formed during a circuit forming process of a copper-clad substrate, a line width of a circuit pattern is likely to vary depending on the level of skill of operators in the conventional control methods where processing time in an etching treatment process is changed on the basis of a line width data measurement result of an appearance inspection performed after the circuit forming process to obtain a uniform line width.SOLUTION: When a fine circuit pattern is formed during a circuit forming process of a copper-clad substrate, a concentration of an etchant in an etching treatment process is changed on the basis of a line width data measurement result of an appearance inspection performed after the circuit forming process to uniformly control the line width of the circuit pattern.