MULTIMODAL POLYETHYLENE MATERIAL

PROBLEM TO BE SOLVED: To provide new polyethylene materials that provide superior high temperature resistance (e.g., in the range of operating temperatures from about 40°C to about 80°C and test temperatures up to about 110°C), high stress resistance, good tensile and impact performance, and excelle...

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Bibliographische Detailangaben
Hauptverfasser:	DAMEN JULIEN, QUACK WOLFGANG, SCHRAMM DETLEF, CHAM PAK-MENG
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PIPES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THEIR PREPARATION OR CHEMICAL WORKING-UP THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide new polyethylene materials that provide superior high temperature resistance (e.g., in the range of operating temperatures from about 40°C to about 80°C and test temperatures up to about 110°C), high stress resistance, good tensile and impact performance, and excellent processability without having to be crosslinked, which are suitable for durable applications such as a pipe.SOLUTION: The present invention relates to a polyethylene resin having a multimodal molecular weight distribution. The resin has a density in the range from about 0.925 g/ccm to about 0.950 g/ccm, and a melt index (I) in the range from about 0.05 g/10 min to about 5 g/10 min. It comprises at least one high molecular weight (HMW) ethylene interpolymer and at least one low molecular weight (LMW) ethylene polymer. The present invention also relates to a composition comprising such a resin.