INSULATING EPOXY RESIN COMPOSITION, AND INSULATING FILM AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME

PROBLEM TO BE SOLVED: To provide: an insulating epoxy resin composition providing a low coefficient of thermal expansion as well as a low dielectric dissipation factor and a low dielectric constant; and an insulating film and a multilayer printed circuit board which are manufactured using the compos...

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Bibliographische Detailangaben
Hauptverfasser:	JEON KEE SU, LEE SA YONG, SHIM JI HYE, KIM JINYOUNG, LEE JEONG KYU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: an insulating epoxy resin composition providing a low coefficient of thermal expansion as well as a low dielectric dissipation factor and a low dielectric constant; and an insulating film and a multilayer printed circuit board which are manufactured using the composition.SOLUTION: The insulating epoxy resin composition comprises: a liquid crystal oligomer (A) represented by the specified chemical formula 1; an epoxy resin (B); an active ester hardener (C); and an inorganic filler (D). (In the formula, a is an integer of 13-26, b is an integer of 13-26, c is an integer of 9-21, d is an integer of 10-30, e is an integer of 10-30, f is an integer of 13-17, and R1 and R2 are identical or different and are each a C1-C20 alkyl group.)