NANOCOMPOSITE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain a nanocomposite resin cured product which is capable of obtaining long-term reliability by preventing peeling at the interface between an inorganic filler and a resin.SOLUTION: The nanocomposite resin composition contains: a thermosetting resin, a thermoplastic resin,...

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Bibliographische Detailangaben
Hauptverfasser:	HIROSE TAKAYUKI, HITOMI MIYAKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a nanocomposite resin cured product which is capable of obtaining long-term reliability by preventing peeling at the interface between an inorganic filler and a resin.SOLUTION: The nanocomposite resin composition contains: a thermosetting resin, a thermoplastic resin, or a resin composed of their combination; a silane coupling agent; and an inorganic filler. The inorganic filler is inorganic particles having a surface hydroxyl group density of 4-8 groups/nmand made of a metal oxide or a metal nitride. The nanocomposite resin cured product is obtained by curing the nanocomposite resin composition.