FINE STRUCTURE TRANSFER-MOLDING DEVICE HAVING RELEASE PLATE

PROBLEM TO BE SOLVED: To provide a fine structure transfer-molding device, in which a microstructure, which is a dense microstructure with high aspect ratio or a fine structure in a nanometer order having a large release resistance from a stamper, can be quickly released from a stamper without damag...

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Bibliographische Detailangaben
Hauptverfasser:	NAITO AKIHIRO, TAKEYA MASAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a fine structure transfer-molding device, in which a microstructure, which is a dense microstructure with high aspect ratio or a fine structure in a nanometer order having a large release resistance from a stamper, can be quickly released from a stamper without damages.SOLUTION: The fine structure transfer-molding device transfers and molds a fine structure into a resin by cooperation of a lower mold that holds a stamper having the fine structure and an upper mold opposing to the lower mold. The device comprises: a release plate which is shaped to have a window to accommodate the fine structure and is disposed on an upper surface of the stamper; and guide means and drive means to vertically move the release plate in a perpendicular direction to the stamper.