SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To prevent the occurrence of cracks in trenches adjacent to element isolation trench structures arranged in an aggregated manner.SOLUTION: A semiconductor device comprises: a semiconductor substrate; first and second element isolation trenches 30, 20 formed on one principal sur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FURUHIRA TAKAAKI, ORITSU MINAKO, KAJI TAKAO, SASAKI KATSUHITO, DOI YUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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