MOLD PACKAGE AND MANUFACTURING METHOD OF THE SAME

MOLD PACKAGE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To realize an insulation layer which is excellent in adhesion to a mold resin and is suitable for inhibiting resin burrs in a mold package where an island, in which an electronic component is mounted on one surface side and the insulation layer is provided on the other surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NOMURA TORU, NOMURA TAKUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To realize an insulation layer which is excellent in adhesion to a mold resin and is suitable for inhibiting resin burrs in a mold package where an island, in which an electronic component is mounted on one surface side and the insulation layer is provided on the other surface side, is sealed by the mold resin composed of a thermosetting resin including an epoxy resin so that the insulation layer is exposed.SOLUTION: A mold resin 40 seals an end part 10a of an island 10 and an end part 33 of an insulation layer 30 at the other surface 12 side of the island 10. A surface 32 in the insulation layer 30, which is opposite to the other surface 12 of the island 10, is exposed from the mold resin 40. The insulation layer 30 is composed of a thermoplastic resin having a functional group that is chemically bonded to an epoxy resin forming the mold resin 40.