ELECTRONIC COMPONENT, SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component having improved reliability.SOLUTION: An electronic component (1) includes an element assembly (10) and first and second external electrodes (13, 14) disposed on the outer surface of the element assembly (10). The first and second external ele...

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Hauptverfasser: TASEDA YASUNORI, FUJIMOTO TSUTOMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component having improved reliability.SOLUTION: An electronic component (1) includes an element assembly (10) and first and second external electrodes (13, 14) disposed on the outer surface of the element assembly (10). The first and second external electrodes (13, 14) include layers containing metallic copper and protective layers (15, 16) made of copper oxide which cover the layers containing metallic copper at edge ends, facing each other on the element assembly (10), of the first and second external electrodes (13, 14).