MOLDING APPARATUS FOR OPTICAL ELEMENT, MOLD AND MOLDING METHOD FOR OPTICAL ELEMENT

PROBLEM TO BE SOLVED: To provide a molding apparatus for optical elements capable of controlling a temperature distribution effectively of the molding apparatus and capable of forming a high precision optical element with high yield.SOLUTION: A molding apparatus 1 for optical elements is as followin...

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Hauptverfasser:	ISHIDA TETSUYA, MURAOKA HIROTAKE, MIYAZAKI SUNAO, WATANABE NAOYA, YODA KAZUNARI, OGAMI SOJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a molding apparatus for optical elements capable of controlling a temperature distribution effectively of the molding apparatus and capable of forming a high precision optical element with high yield.SOLUTION: A molding apparatus 1 for optical elements is as following. A mold 50 in which an optical element material is mounted between an upper die and lower die is sequentially transferred to each stage of heating, pressing and cooling stages, 3, 4 and 5. Eventually, optical element is formed. In the stages, heating, pressing and cooling, the mold is mounted. For the mold mounted, a plurality of plates for performing heating, pressing and cooling processes are prepared such as upper and lower paired heating plates 3b, upper and lower press plates 4b and upper and lower cooling plates 5b, respectively. The surface coarseness expressed by Rz of a mounting surface of the mold 50 of the cooling plate 5b is kept over 7 μm, or so as to reduce a contact thermal heat transfer coefficient, a convex and concave shape is introduced between the mold and the cooling plate.