POWER CONVERSION DEVICE

PROBLEM TO BE SOLVED: To provide a power conversion device that allows achieving downsizing, low cost, and high reliability.SOLUTION: A power conversion device includes: a power semiconductor element having a semiconductor chip converting a DC current into an AC current and lead wiring electrically...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKEZAWA YOSHITAKA, ISHII TOSHIAKI, NAKATSU KINYA, MIYAZAKI HIDEKI, HOZOJI HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a power conversion device that allows achieving downsizing, low cost, and high reliability.SOLUTION: A power conversion device includes: a power semiconductor element having a semiconductor chip converting a DC current into an AC current and lead wiring electrically connected to the semiconductor chip; a wiring member transmitting the DC current or the AC current to the power semiconductor element; a fixture to which the wiring member is fixed; and a heat dissipation base having a hollow portion formed so that its top surface side is open. The power semiconductor element is disposed in the hollow portion so that the lead wiring extends from the inside of the hollow portion to the top surface side. The fixture is disposed on the top surface of the heat dissipation base and has a through hole at the opposite position to the lead wiring. The lead wiring penetrates through the through hole and is connected to the wiring material. The power semiconductor element and the fixture are fixed to the heat dissipation base.