COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method capable of preventing occurrence of unfinished substrate due to missing component.SOLUTION: While performing substrate production operation, the component mounting apparatus counts the number γ of compone...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA TOMIO, NOTOMI RYO, HATTORI YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method capable of preventing occurrence of unfinished substrate due to missing component.SOLUTION: While performing substrate production operation, the component mounting apparatus counts the number γ of components to be sucked which is the number of components 4 as the target of suction by a mounting head 15, calculates the allowance number of disposal components according to the counted number of components γ to be sucked and counts the actual disposal component number representing the component number actually disposed of. Comparing the actual disposal component number and the disposal allowance number counted, and as a result when the actual disposal component number exceeds the disposal allowance number , an alarming unit performs an alarming operation.