MANUFACTURING METHOD FOR SUBSTRATE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, OSCILLATOR, GYRO SENSOR, ELECTRONIC APPARATUS AND MOVING BODY

PROBLEM TO BE SOLVED: To obtain a manufacturing method for a substrate and a manufacturing method for an electronic device that can suppress solder leaching while securing joint areas.SOLUTION: A manufacturing method for an electronic device includes: a step of preparing a substrate in which a throu...

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Bibliographische Detailangaben
Hauptverfasser:	SUGANO HIDEYUKI, SUGANO MASAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GYROSCOPIC INSTRUMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS NAVIGATION PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURVEYING TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a manufacturing method for a substrate and a manufacturing method for an electronic device that can suppress solder leaching while securing joint areas.SOLUTION: A manufacturing method for an electronic device includes: a step of preparing a substrate in which a through hole passing through from a front surface to a back surface of the substrate is filled with a conductive material and a conductive metal film is disposed on at least one exposed surface out of the conductive material exposed on the front and back surfaces of the substrate and electronic components having connection portions formed of solder; an electronic component mounting step of mounting the electronic components on the substrate such that the connection portions are brought into contact on the conductive metal film; and a soldering step of heating and melting the solder of the connection portions and fixing the connection portions and the conductive metal film together via the solder.