VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD

VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a method for controlling excellent transfer under a situation in which a time necessary for processing is not stable in a vacuum processing apparatus of a linear tool in which a plurality of transfer robots are arranged in a transfer mechanism part with a processing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NOGI KEITA, NAKADA TERUO, INOUE TOMOMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NOGI KEITA
NAKADA TERUO
INOUE TOMOMI
description PROBLEM TO BE SOLVED: To provide a method for controlling excellent transfer under a situation in which a time necessary for processing is not stable in a vacuum processing apparatus of a linear tool in which a plurality of transfer robots are arranged in a transfer mechanism part with a processing chamber connected thereto, and an object to be processed is transferred between the plurality of robots.SOLUTION: A load lock existing on a path to the processing chamber or a wafer holding mechanism of an intermediate chamber is reserved in each next transfer predetermined wafer in each processing chamber, and in the case where load locks or holding mechanisms of the intermediate chamber are entirely reserved, a transfer destination is determined except the processing chamber when determining the transfer destination of the next wafer to be transferred.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013251420A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013251420A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013251420A3</originalsourceid><addsrcrecordid>eNrjZLAIc3QODfVVCAjyd3YNDvb0c1dwDAhwDHIMCQ1WcPRzUcCU93UN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGxkamhiZGBo7GRCkCANYlKRw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD</title><source>esp@cenet</source><creator>NOGI KEITA ; NAKADA TERUO ; INOUE TOMOMI</creator><creatorcontrib>NOGI KEITA ; NAKADA TERUO ; INOUE TOMOMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method for controlling excellent transfer under a situation in which a time necessary for processing is not stable in a vacuum processing apparatus of a linear tool in which a plurality of transfer robots are arranged in a transfer mechanism part with a processing chamber connected thereto, and an object to be processed is transferred between the plurality of robots.SOLUTION: A load lock existing on a path to the processing chamber or a wafer holding mechanism of an intermediate chamber is reserved in each next transfer predetermined wafer in each processing chamber, and in the case where load locks or holding mechanisms of the intermediate chamber are entirely reserved, a transfer destination is determined except the processing chamber when determining the transfer destination of the next wafer to be transferred.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131212&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013251420A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131212&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013251420A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOGI KEITA</creatorcontrib><creatorcontrib>NAKADA TERUO</creatorcontrib><creatorcontrib>INOUE TOMOMI</creatorcontrib><title>VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a method for controlling excellent transfer under a situation in which a time necessary for processing is not stable in a vacuum processing apparatus of a linear tool in which a plurality of transfer robots are arranged in a transfer mechanism part with a processing chamber connected thereto, and an object to be processed is transferred between the plurality of robots.SOLUTION: A load lock existing on a path to the processing chamber or a wafer holding mechanism of an intermediate chamber is reserved in each next transfer predetermined wafer in each processing chamber, and in the case where load locks or holding mechanisms of the intermediate chamber are entirely reserved, a transfer destination is determined except the processing chamber when determining the transfer destination of the next wafer to be transferred.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAIc3QODfVVCAjyd3YNDvb0c1dwDAhwDHIMCQ1WcPRzUcCU93UN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGxkamhiZGBo7GRCkCANYlKRw</recordid><startdate>20131212</startdate><enddate>20131212</enddate><creator>NOGI KEITA</creator><creator>NAKADA TERUO</creator><creator>INOUE TOMOMI</creator><scope>EVB</scope></search><sort><creationdate>20131212</creationdate><title>VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD</title><author>NOGI KEITA ; NAKADA TERUO ; INOUE TOMOMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013251420A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NOGI KEITA</creatorcontrib><creatorcontrib>NAKADA TERUO</creatorcontrib><creatorcontrib>INOUE TOMOMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NOGI KEITA</au><au>NAKADA TERUO</au><au>INOUE TOMOMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD</title><date>2013-12-12</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method for controlling excellent transfer under a situation in which a time necessary for processing is not stable in a vacuum processing apparatus of a linear tool in which a plurality of transfer robots are arranged in a transfer mechanism part with a processing chamber connected thereto, and an object to be processed is transferred between the plurality of robots.SOLUTION: A load lock existing on a path to the processing chamber or a wafer holding mechanism of an intermediate chamber is reserved in each next transfer predetermined wafer in each processing chamber, and in the case where load locks or holding mechanisms of the intermediate chamber are entirely reserved, a transfer destination is determined except the processing chamber when determining the transfer destination of the next wafer to be transferred.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2013251420A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T22%3A53%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NOGI%20KEITA&rft.date=2013-12-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013251420A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true