FILM FORMING APPARATUS

PROBLEM TO BE SOLVED: To provide an organic EL device manufacturing device by which conveyance of a substrate can be conducted with the deposition surface up in a vacuum with a simple mechanism, and vapor deposition can be made with high definition even in the conveyance with the deposition surface...

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Bibliographische Detailangaben
Hauptverfasser:	NIRASAWA NOBUHIRO, YUMIBA KENJI, OCHIAI YUKIO, WAKABAYASHI MASA, ASADA MIKIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an organic EL device manufacturing device by which conveyance of a substrate can be conducted with the deposition surface up in a vacuum with a simple mechanism, and vapor deposition can be made with high definition even in the conveyance with the deposition surface up, a manufacturing method thereof, a film forming apparatus or a film forming method.SOLUTION: A substrate is conveyed in a vacuum with its vapor deposition surface up, and at least when the substrate moves, the conveyance surface of the substrate is held so as not to slide. The substrate is delivered in the vacuum chamber, and then the substrate is erected vertically or roughly vertically for vapor deposition. A plurality of the substrates that have been conveyed with the vapor deposition surface up are subjected to vapor deposition in one vacuum vapor deposition chamber alternately with the same vapor deposition source.