PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD

PROBLEM TO BE SOLVED: To provide a simple and low-cost partial plating device of an object to be plated by wet plating, and a partial plating method that achieves accurate partial plating by suppressing an occurrence of plating leakage, a pinhole, a pit, and plating unevenness, eliminates a step of...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA YOSHIYASU, FURUHASHI TAKAHIRO, ICHIHARA YOSHIJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a simple and low-cost partial plating device of an object to be plated by wet plating, and a partial plating method that achieves accurate partial plating by suppressing an occurrence of plating leakage, a pinhole, a pit, and plating unevenness, eliminates a step of sealing the object to be plated with a coating material and a step of removing the coating material after the plating treatment, reduces the used amount of plating liquid and treatment required amount of plating liquid after the use, and eliminates the application of a pump for high-pressure injecting the plating liquid, plating liquid suction pump, and a pressurizing means in the device.SOLUTION: In a device for moving bubbles 8 of plating liquid in a transfer pipe 5 by using a foam plating method, an opening 11 of the predetermined shape is installed in a part of the transfer pipe 5, a part to be plated on an object to be plated is exposed to the opening 11, and partial plating by the foam plating method is performed in a flow of the bubbles.