ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD FOR ELECTROLYTIC COPPER PLATING

PROBLEM TO BE SOLVED: To provide an electrolytic copper plating solution which includes a specific compound containing a sulfur atom, and is also suitable for forming filled vias without using formaldehyde and without causing worsening of the external appearance of plating; and to provide a method f...

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Hauptverfasser:	SAKAI MAKOTO, MIZUNO YOKO, HAYASHI SHINJIRO, MORINAGA TOSHIYUKI, SAITO ATSUKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electrolytic copper plating solution which includes a specific compound containing a sulfur atom, and is also suitable for forming filled vias without using formaldehyde and without causing worsening of the external appearance of plating; and to provide a method for electrolytic copper plating using the plating solution.SOLUTION: An electrolytic copper plating solution includes a compound having a -X-S-Y- structure (wherein, X and Y are individually atoms selected from the group comprising hydrogen, carbon, sulfur, nitrogen and oxygen atoms, and X and Y can be the same only when they are carbon atoms) and a specific nitrogen-containing compound. A method for electrolytic copper plating using the plating solution is also provided.