METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component module, capable of improving electromagnetic shield characteristics and connection reliability, and preventing reductions in electric resistance characteristics and electric characteristics.SOLUTION: An electronic co...
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| creator | KOMATSU MASATORA KAWABATA KENICHI |
| description | PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component module, capable of improving electromagnetic shield characteristics and connection reliability, and preventing reductions in electric resistance characteristics and electric characteristics.SOLUTION: An electronic component module 100 is obtained by forming a conductive shield 51 so as to cover electronic components 2 mounted on a circuit board 1 and a mold resin 3. The conductive shield 51 includes a first filler such as Cu and a second filler such as SnBi, and is connected to a grounding wiring line 11. The second filler is melted at a temperature of 250°C or less and is welded to the first filler. At least one of the first filler and the second filler contains metal corroded by a reducing agent. When the conductive shield 51 is formed, conductive paste applied onto the mold resin is heated in an atmosphere reduced in oxygen concentration compared to the atmosphere. |
| format | Patent |
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The conductive shield 51 includes a first filler such as Cu and a second filler such as SnBi, and is connected to a grounding wiring line 11. The second filler is melted at a temperature of 250°C or less and is welded to the first filler. At least one of the first filler and the second filler contains metal corroded by a reducing agent. 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The conductive shield 51 includes a first filler such as Cu and a second filler such as SnBi, and is connected to a grounding wiring line 11. The second filler is melted at a temperature of 250°C or less and is welded to the first filler. At least one of the first filler and the second filler contains metal corroded by a reducing agent. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE |
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