METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component module, capable of improving electromagnetic shield characteristics and connection reliability, and preventing reductions in electric resistance characteristics and electric characteristics.SOLUTION: An electronic component module 100 is obtained by forming a conductive shield 51 so as to cover electronic components 2 mounted on a circuit board 1 and a mold resin 3. The conductive shield 51 includes a first filler such as Cu and a second filler such as SnBi, and is connected to a grounding wiring line 11. The second filler is melted at a temperature of 250°C or less and is welded to the first filler. At least one of the first filler and the second filler contains metal corroded by a reducing agent. When the conductive shield 51 is formed, conductive paste applied onto the mold resin is heated in an atmosphere reduced in oxygen concentration compared to the atmosphere.