BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

PROBLEM TO BE SOLVED: To enhance throughput of bonding process by bonding a processed substrate and a support substrate efficiently.SOLUTION: A bonding system 1 includes a carry-in/carry-out station 2 and a processing station 3. The processing station 3 includes an adhesive coating device for coatin...

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Bibliographische Detailangaben
1. Verfasser:	DEGUCHI MASATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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