BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

PROBLEM TO BE SOLVED: To enhance throughput of bonding process by bonding a processed substrate and a support substrate efficiently.SOLUTION: A bonding system 1 includes a carry-in/carry-out station 2 and a processing station 3. The processing station 3 includes an adhesive coating device for coating a processed wafer W with adhesive, a protective agent coating device for coating a processed wafer W with a protective agent, a parting agent coating device 42 for coating a support wafer with a parting agent, a heat treatment device 43 for heating the processed wafer W or a support wafer, coated at least with the adhesive, protective agent or parting agent, to a predetermined temperature, bonding devices 30-33 for bonding the processed wafer W and the support wafer via the adhesive, protective agent and parting agent, and a wafer transfer region 60 for transferring the processed wafer W, the support wafer or a superimposed wafer T.