LAMINATE FOR CIRCUIT BOARD, METALLIC BASE CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THEM

PROBLEM TO BE SOLVED: To simultaneously attain high withstand voltage and high peel strength.SOLUTION: A method for manufacturing a laminate for a circuit board comprises the steps of: transferring an insulation layer 3' which is formed on a support 5, contains electrical insulating resin 3a�...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KONDO GOJI, KOYAMA NOBUAKI, MIYAKOSHI RYO, IWASA TAKETOSHI, KUSAKAWA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To simultaneously attain high withstand voltage and high peel strength.SOLUTION: A method for manufacturing a laminate for a circuit board comprises the steps of: transferring an insulation layer 3' which is formed on a support 5, contains electrical insulating resin 3a' and an electrical insulating inorganic filler 3b and arbitrarily contains solvent from the support 5 to metal foil; and sticking the metal foil and a metal substrate together by sandwiching the insulation layer 3' between them.