METHOD FOR CUTTING PANEL FOR BUILDING

PROBLEM TO BE SOLVED: To provide a method for cutting a panel, the method capable of suppressing scattering of chip powder so as to prevent wetting of an ALC panel and its surroundings.SOLUTION: A liquid having viscosity 10 is applied to the front face of a cutting planned part A of an ALC panel 1,...

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Bibliographische Detailangaben
1. Verfasser:	TAKAGI YOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING BUILDING IMPLEMENTS OR OTHER BUILDING AIDS, OR THEIRUSE FIXED CONSTRUCTIONS FORMS HANDLING BUILDING MATERIALS ON THE SITE REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTINGBUILDINGS SCAFFOLDING SHUTTERING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for cutting a panel, the method capable of suppressing scattering of chip powder so as to prevent wetting of an ALC panel and its surroundings.SOLUTION: A liquid having viscosity 10 is applied to the front face of a cutting planned part A of an ALC panel 1, and then, the cutting planned part A is cut with an electric saw 12. The liquid having viscosity 10 may be applied to the rear face of the cutting planned part A as well as the front face. When cutting the cutting planned part A of the ALC panel 1 with the electric saw 12, a cut groove B may be formed in a surface layer part of the ALC panel 11, and then cutting may be stopped to inject the liquid having viscosity 10 into the cut groove B, and then, cutting may be started again.