CERAMIC PACKAGE
PROBLEM TO BE SOLVED: To provide a ceramic package which makes a metalized layer less likely to be peeled from a ceramic package body and also makes a brazing material brazing a metal frame less likely to be remelted and become droplets when a metal lid sealing an opening of a cavity is joined onto...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a ceramic package which makes a metalized layer less likely to be peeled from a ceramic package body and also makes a brazing material brazing a metal frame less likely to be remelted and become droplets when a metal lid sealing an opening of a cavity is joined onto the metalized layer or the metal frame, and which easily deals with the downsizing.SOLUTION: A ceramic package 1 includes: a ceramic package body 2 having a front surface 3 and a rear surface 4 that have rectangular outer shapes when viewed in a planar view, and having a cavity 6 opening on the front surface 3 and composed of a bottom surface 7 and a side surface 8; and a metalized layer 10 formed on the front surface 3 having a rectangular frame shape in a planar view so as to enclose the opening of the cavity 6. On the front surface 3 of the package body 2, a thickness of the metalized layer 10 at an outer side surface 5 side of the package body 2 is larger than a thickness of the metalized layer 10 at the side surface 8 side of the cavity 6. |
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