SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a low-cost semiconductor device that has a thermal expansion coefficient similar to the thermal expansion coefficient of a semiconductor element and in which a component made from a material having a high thermal conductivity is mounted to the semiconductor element.S...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MOTODA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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