SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a low-cost semiconductor device that has a thermal expansion coefficient similar to the thermal expansion coefficient of a semiconductor element and in which a component made from a material having a high thermal conductivity is mounted to the semiconductor element.S...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MOTODA TAKASHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a low-cost semiconductor device that has a thermal expansion coefficient similar to the thermal expansion coefficient of a semiconductor element and in which a component made from a material having a high thermal conductivity is mounted to the semiconductor element.SOLUTION: A semiconductor device according to the present invention includes: a semiconductor element having a substrate made from GaAs, InP, or GaN; and an element-fixing component made from a composite material of Cu and a carbon material or a composite material of Al and the carbon material, and soldered to the semiconductor element.