INSPECTION DEVICE

PROBLEM TO BE SOLVED: To lessen foreign substances adhered to a semiconductor wafer in a semiconductor surface inspection device as compared to conventional techniques, in a situation where: the diameter of the foreign substances causing problems becomes smaller and therefore further enhancement of cleanliness within the device is necessary; and this invention found out that the foreign substances drifting in an atmosphere around the wafer are adhered to the wafer in the course of gathering to the center of the wafer and moving from the center of the wafer to the outer periphery according to rotation of the wafer.SOLUTION: In this invention, a medium is supplied toward an inner peripheral part of a substrate from two directions. Thus, foreign substances adhered to a wafer can be lessened, as compared to before.