CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a circuit board which, even when non-contact type pattern exposure is applied to an unexposed solder resist, can reduce dropping of a solder resist, has high accuracy, and can also improve yield and reliability.SOLUTION: In a circuit board having a circuit pattern 3...

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Bibliographische Detailangaben
Hauptverfasser:	TSUBOMATSU YOSHIAKI, SAKURAI TAKEHISA, NAMATAME KAZUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a circuit board which, even when non-contact type pattern exposure is applied to an unexposed solder resist, can reduce dropping of a solder resist, has high accuracy, and can also improve yield and reliability.SOLUTION: In a circuit board having a circuit pattern 3 coated with a development type solder resist pattern 20, the solder resist pattern 20 has places where the number of pattern exposure is different, by partially overlapping the pattern exposure performed before development.