EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING THE SAME, AND HEAT DISSIPATION CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide an epoxy resin having electric insulation properties and excellent thermal conductivity and a high heat radiation epoxy resin substrate using an epoxy resin composition.SOLUTION: Thermal conductivity is improved using an epoxy resin including a mesogen structure by w...

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Bibliographische Detailangaben
Hauptverfasser:	YUN SUNGJIN, MOON SUNGBAE, YOON JONGHEUM, CHO IN HEE, KIM HAE YEON, PARK JEUNGOOK, JEONG JAEHUN, PARK JAE MAN, LEE HYUK SOO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin having electric insulation properties and excellent thermal conductivity and a high heat radiation epoxy resin substrate using an epoxy resin composition.SOLUTION: Thermal conductivity is improved using an epoxy resin including a mesogen structure by which crystallinity is improved. A high heat radiation substrate is provided by using the epoxy resin as an insulation material for a printed circuit board.