MICROSTRUCTURE TRANSFER DEVICE AND MICROSTRUCTURE TRANSFER METHOD

PROBLEM TO BE SOLVED: To provide a microstructure transfer device having excellent transfer accuracy in which releasing properties can be ensured even if continuous transfer is repeated, and to provide a microstructure transfer method.SOLUTION: Releasing properties are ensured and transfer failure i...

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Bibliographische Detailangaben
Hauptverfasser:	WASHITANI RYUTA, HASEGAWA MITSURU, OGINO MASAHIKO, MIYAUCHI AKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a microstructure transfer device having excellent transfer accuracy in which releasing properties can be ensured even if continuous transfer is repeated, and to provide a microstructure transfer method.SOLUTION: Releasing properties are ensured and transfer failure is prevented by coating the surface of a resin having fluidity before transfer with a mold release agent, and always forming a constant amount of mold-release layer on the boundary surface of the resin and a mold. Adhesion of the mold release agent to the mold surface is suppressed by using a perfluoro compound or a siloxane compound having, at the terminal thereof, a curable fluid and a parent fluid part including a functional group having reactivity, as the mold-release agent being applied onto the resin surface.