PHOTOMASK BLANK AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a photomask blank that is small in warpage and small in a warpage change amount after a photomask manufacturing process is ended.SOLUTION: When manufacturing a photomask blank having a laminate including at least a kind of functionality transparent film formed on a s...

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Bibliographische Detailangaben
1. Verfasser:	FUKAYA SOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photomask blank that is small in warpage and small in a warpage change amount after a photomask manufacturing process is ended.SOLUTION: When manufacturing a photomask blank having a laminate including at least a kind of functionality transparent film formed on a substrate transparent to exposure light, a heat process is performed at least one time after implementation of any of three steps of a step of forming at least the kind of the functionality transparent film on a substrate, a step of performing a flash irradiation process when an absolute value of a warpage amount on the substrate of the functionality transparent film is 0.1 μm or more, and a step of laminating a functionality film different from the functionality transparent film to form the laminate. Firstly, a phase shift film is formed (S101), and the heat process within a temperature range of 260°C to 320°C and for 4 hours or more is performed to the phase shift film (S102). Then, the flash irradiation process is performed (S103). A light shield film is formed on the phase shift film after these processes (S104) and the photomask blank is obtained (S105).