METHOD FOR PATTERNING NON METAL CONDUCTIVE LAYER

PROBLEM TO BE SOLVED: To provide a method for patterning a non metal conductive layer in a circuit board.SOLUTION: A non metal conductive layer 14 and a negative type photoresist layer 20 are sequentially formed on a substrate 12 of a circuit board. Subsequently, after the negative type photoresist...

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Bibliographische Detailangaben
Hauptverfasser:	CHANG CHIENNG, CHIEN YUUN, LIN DA-SHAN, LIN HAN-HSIANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOUNDS THEREOF CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY NON-METALLIC ELEMENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for patterning a non metal conductive layer in a circuit board.SOLUTION: A non metal conductive layer 14 and a negative type photoresist layer 20 are sequentially formed on a substrate 12 of a circuit board. Subsequently, after the negative type photoresist layer is exposed through a patterned photomask 30, the negative type photoresist layer is developed using a developing solution. Next, the non metal conductive layer is etched. Lastly, the remaining photoresist layer is removed by a non-alkaline peeling solution to obtain a patterned non metal layer on the substrate.