SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a plurality of bonding wires are connected to one connection pad, which has high reliability in the connected parts and is easy to be downsized.SOLUTION: A semiconductor device 9 comprises: an insulation substrate 1; at least one connection pad 2 provided on the insulation substrate 1; a semiconductor element 3 which has a plurality of electrodes 3a and which is mounted on the insulation substrate 1; a plurality of bonding wires 4(4a) each of which has one end and the other end, and any of the one ends are connected to one connection pad 2 in an overlapping manner and the other ends are respectively connected to the plurality of electrodes 3a; and a metal layer 7 which is composed of gold or copper and sandwiched between the one ends of the plurality of bonding wires 4. An area where the plurality of bonding wires 4 are connected can be minimized. The metal layer 7 can ensure connection strength at connected parts of the bonding wires 4 on the lower side.