COMPOUND MACHINING DEVICE

PROBLEM TO BE SOLVED: To improve the machining accuracy by a method without attending complication of the structure which results a remarkable increase in costs in regard to a compound machining device capable of performing cutting and electric discharge machining.SOLUTION: A machining unit is loade...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASUZAWA TAKAHISA, HAYASAKA NOBUAKI, HASEGAWA MASAHARU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve the machining accuracy by a method without attending complication of the structure which results a remarkable increase in costs in regard to a compound machining device capable of performing cutting and electric discharge machining.SOLUTION: A machining unit is loaded on a head 2 having a function as a Z stage, the head 2 is loaded on a Y stage 16, and a work table 8, on which a work 9 is to be loaded and fixed, is loaded on a X stage 13 so as to prevent the mutual interference of the operation in each direction. The head 2 is loaded with a first CMOS camera 5 to detect the position of the work 9, and a second CMOS camera 14 is disposed under a base 1, and at least a part of the members such as the work table 8 is structured of a transparent material so that the position of the work 9 is detected when machining the work 9. With this structure, machining accuracy in fine machining can be secured.