MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To solve the problem that, in a chip pickup step after dicing in an assembly step of a semiconductor integrated circuit device manufacturing process, it is an important subject to reduce a pickup failure because of rapid chip thinning, in particular, a possibility for a chip peripheral part curved by exfoliation to induce chip cracking or breaking is high.SOLUTION: When exfoliating a chip from a dicing tape (adhesive tape) or the like through vacuum adsorption using a suction collet, a flow rate of a vacuum adsorption system of the suction collet is monitored, thereby monitoring a curved state of the chip before completely exfoliating the chip from the adhesive tape.