ELECTROLESS METAL PLATING APPARATUS
PROBLEM TO BE SOLVED: To provide an electroless metal plating apparatus which can extend the life of an electroless plating solution and also stably perform continuous plating.SOLUTION: An electroless metal plating apparatus includes: a plating tank for immersing a substrate to be plated into a plat...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electroless metal plating apparatus which can extend the life of an electroless plating solution and also stably perform continuous plating.SOLUTION: An electroless metal plating apparatus includes: a plating tank for immersing a substrate to be plated into a plating solution and plating the substrate with a metal; a metal dissolution tank in which the metal is dissolved with the plating solution extracted from the plating tank for replenishing ions of the metal thereto; an oxygen-enriched gas feeding unit for feeding an oxygen-enriched gas to the plating solution fed to the metal dissolution tank; an aeration tank for lowering the concentration of dissolved oxygen contained in the plating solution fed from the metal dissolution tank to produce an aeration fluid; and an aeration fluid conveying unit for transferring the aeration fluid to the plating tank from the aeration tank. The aeration tank includes a micro-air feeding unit for feeding air with a fine bubble diameter to the plating solution within the aeration tank. |
---|