ELECTROLESS METAL PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide an electroless metal plating apparatus which can extend the life of an electroless plating solution and also stably perform continuous plating.SOLUTION: An electroless metal plating apparatus includes: a plating tank for immersing a substrate to be plated into a plat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWAMURA TOSHINORI, MIYAZAKI SATOYUKI, KANEMOTO MASARU, AKABOSHI HARUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electroless metal plating apparatus which can extend the life of an electroless plating solution and also stably perform continuous plating.SOLUTION: An electroless metal plating apparatus includes: a plating tank for immersing a substrate to be plated into a plating solution and plating the substrate with a metal; a metal dissolution tank in which the metal is dissolved with the plating solution extracted from the plating tank for replenishing ions of the metal thereto; an oxygen-enriched gas feeding unit for feeding an oxygen-enriched gas to the plating solution fed to the metal dissolution tank; an aeration tank for lowering the concentration of dissolved oxygen contained in the plating solution fed from the metal dissolution tank to produce an aeration fluid; and an aeration fluid conveying unit for transferring the aeration fluid to the plating tank from the aeration tank. The aeration tank includes a micro-air feeding unit for feeding air with a fine bubble diameter to the plating solution within the aeration tank.