COVER MATERIAL FOR PRESS-THROUGH PACK PACKAGE, AND PACKAGE

PROBLEM TO BE SOLVED: To provide a cover material for a press-through pack package which prevents generation of winding creases and is excellent in blocking resistance.SOLUTION: A cover material for a press-through pack package includes a cover material film and a heat seal layer. An arithmetic mean...

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Bibliographische Detailangaben
Hauptverfasser: MATSUKI YUTAKA, HAYASHI HIDEKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a cover material for a press-through pack package which prevents generation of winding creases and is excellent in blocking resistance.SOLUTION: A cover material for a press-through pack package includes a cover material film and a heat seal layer. An arithmetic mean roughness (Ra) of a surface of the heat seal layer is 20 nm or more.