WAFER PROCESSING METHOD

PROBLEM TO BE SOLVED: To form a crystal wafer 1 whose contour has a pseudo circle and in which an orientation flat 6 representing an accurate crystal orientation is formed.SOLUTION: A wafer processing method includes: a lamination step of forming a stack 2 of a quadrangular prism, by arranging a ref...

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Bibliographische Detailangaben
1. Verfasser:	KAWAI NOBORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING RESONATORS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To form a crystal wafer 1 whose contour has a pseudo circle and in which an orientation flat 6 representing an accurate crystal orientation is formed.SOLUTION: A wafer processing method includes: a lamination step of forming a stack 2 of a quadrangular prism, by arranging a reference side KH of a quadrangle crystal wafer 1 having the reference side KH and plurally stacking thereof; a mounting step of attaching the stack 2 to a mounting jig 4 so that a corner 3 of an adjacent side surface of the stack 2 may project from an outer surface of the mounting jig 4; a grinding step of grinding and removing a projecting corner 3; and a chamfering step of chamfering a corner 9 remaining in a periphery of the stack 2 while leaving a reference plane KM and of processing the stack 2 to a column where a cross section has the pseudo circle.