PEELING SYSTEM, PEELING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

PROBLEM TO BE SOLVED: To properly hold a processed substrate peeled from a superposed substrate and properly perform the processing to the processed substrate.SOLUTION: A holding part 60 suctions and holds a processed wafer W when the predetermined processing is performed to the processed wafer W peeled from a superposed wafer T. The holding part 60 includes: a porous 61 where multiple holes are formed; and a suction member 62 suctioning the processed wafer W. The suction member 62 is divided into a center region 63 and an outer peripheral region 64. The holding part 60 may set a suction pressure used for suctioning the processed wafer W for each of the center region 63 and the outer peripheral region 64.